Senior Packaging Engineer
Ireland - Dublin
Key Responsibilities
* Lead the development of advanced packaging technologies, including Flip-Chip, Fan-Out, 2.5D/3D, and System-in-Package (SiP) solutions.
* Collaborate closely with design, process, materials, and reliability engineering teams to ensure high-performance, manufacturable packages.
* Drive package technology development from concept through mass production—covering material selection, process integration, and qualification.
* Perform feasibility studies, risk assessments, and provide recommendations for continuous improvement.
* Develop and optimize thermal, mechanical, and electrical models for package performance and reliability.
* Work with suppliers, foundries, and OSATs to ensure manufacturing scalability and seamless integration.
* Conduct failure analysis and drive corrective actions to improve yield and reliability.
* Stay ahead of industry trends and actively contribute to packaging innovation.
* Mentor and provide technical leadership to junior engineers within the team.
Required Qualifications
* Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
* 5+ years of hands-on experience in semiconductor packaging, including advanced packaging technologies.
* Strong knowledge of package design, material science, and process integration.
* Experience with simulation tools for thermal, mechanical, and electrical modeling.
* Proven success working with OSATs and foundries in packaging development and qualification.
* Excellent problem-solving, communication, and cross-functional collaboration skills.
Preferred Qualifications
* Experience with heterogeneous integration, chiplet packaging, or advanced interconnects.
* Familiarity with PCB and substrate design.
* Knowledge of industry standards such as IPC, JEDEC, and SEMI.
* Proficiency in EDA tools like Cadence Allegro, Mentor Graphics, or Synopsys.
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