Senior Packaging Engineer
Ireland - Dublin
Key Responsibilities
- Lead the development of advanced packaging technologies, including Flip-Chip, Fan-Out, 2.5D/3D, and System-in-Package (SiP) solutions.
- Collaborate closely with design, process, materials, and reliability engineering teams to ensure high-performance, manufacturable packages.
- Drive package technology development from concept through mass production—covering material selection, process integration, and qualification.
- Perform feasibility studies, risk assessments, and provide recommendations for continuous improvement.
- Develop and optimize thermal, mechanical, and electrical models for package performance and reliability.
- Work with suppliers, foundries, and OSATs to ensure manufacturing scalability and seamless integration.
- Conduct failure analysis and drive corrective actions to improve yield and reliability.
- Stay ahead of industry trends and actively contribute to packaging innovation.
- Mentor and provide technical leadership to junior engineers within the team.
Required Qualifications
- Bachelor's, Master's, or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 5+ years of hands-on experience in semiconductor packaging, including advanced packaging technologies.
- Strong knowledge of package design, material science, and process integration.
- Experience with simulation tools for thermal, mechanical, and electrical modeling.
- Proven success working with OSATs and foundries in packaging development and qualification.
- Excellent problem-solving, communication, and cross-functional collaboration skills.
Preferred Qualifications
- Experience with heterogeneous integration, chiplet packaging, or advanced interconnects.
- Familiarity with PCB and substrate design.
- Knowledge of industry standards such as IPC, JEDEC, and SEMI.
- Proficiency in EDA tools like Cadence Allegro, Mentor Graphics, or Synopsys.
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