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Process Integration Engineer - Transition Metal Dichalcogenide (TMD) Electronic Devices., Cork
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Client:
Tyndall National Institute
Location:
Cork, Ireland
Job Category:
Other
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EU work permit required:
Yes
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Job Reference:
dc5557f30306
Job Views:
2
Posted:
01.05.2025
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Job Description:
Process Integration Engineer - Transition Metal Dichalcogenide (TMD) Electronic Devices.
Contract: Full Time/Fixed Term About Tyndall Tyndall National Institute is Ireland’s largest Research and Technology Organisation (RTO) and a flagship Institute of University College Cork.
Specialising in both electronics and photonics, Tyndall works with global industry and academia to transform research into products in its core market areas of electronics, communications, energy, health, agri-tech and the environment.
With a network of over 200 industry partners and customers worldwide, Tyndall is focused on delivering human and economic impact from excellence in research.
Tyndall is home to a research community of 650 people of over 50 nationalities.
Background to the Role Within Tyndall’s Micro Nano Systems Centre, we have created a strategic research programme focusing on materials, emerging devices and architectures for future information processing, interfacing with CMOS and beyond (“CMOS++ Materials & Devices”).
CMOS++ is involved in the Chips JU NanoIC pilot line co-funded by the European Commission and national agencies as part of the targeted initiatives of the EU Chips Act.
The implementation of the Chips JU pilot lines is expected to bridge the gap from lab to fab and will be available to a wide range of users, including academia, industry and research institutions.
The NanoIC pilot line is the result of a remarkable European cross-border collaboration.
Hosted by imec (Belgium), its partners include CEA-Leti (France), Fraunhofer (Germany), VTT (Finland), CSSNT (Romania) and Tyndall National Institute (Ireland).
NanoIC targets semiconductor technologies that will shape tomorrow’s high-tech solutions.
One of the main goals is to develop the process steps and modules that enable these technologies.
This will result in stable ‘platform’ baseline flows with a high technology readiness level (TRL 4-6).
These technologies are situated in three research pillars: 1.
Advanced logic technologies 2.
Advanced memory technologies 3.
Advanced interconnect technologies In NanoIC, Tyndall’s flexibility into materials integration will allow for rapid, short-cycle screening to reduce the cycle time in identifying and integrating highly performing materials to carry forward into IC development.
Our role is to provide agile wafer scale nanofabrication and processing beyond silicon for the integration of selected new materials – Transition Metal Dichalcogenides (TMDs) and oxide semiconductor (OSC) – and FET device architectures.
The goal is to develop a material platform for embedded DRAM and above IC functionality, thereby providing a key technology block to enable leading-edge ICs.
Purpose of the Role This role is central to bridging research concepts with practical fabrication, ensuring that innovative ideas from the NanoIC program are successfully translated into robust device flows.
As the Process Integration Engineer, you will be responsible for planning and executing end-to-end fabrication runs in Tyndall’s flexifab, using a variety of process modules and advanced metrology methods.
By designing and running experiments, collecting and analyzing data, and iterating on process flows, you will help drive continuous improvements in device performance.
Although you will report into the SP&S group, you will work closely with researchers and domain experts within the NanoIC program who will guide much of the technical direction.
Your hands-on approach in the cleanroom—coupled with thorough documentation of procedures and results—will be essential for turning cutting-edge research ideas into tangible outcomes.
By proactively identifying and mitigating risks, you will also ensure that all process developments align with the highest standards of quality and safety.
Through collaboration and mentorship, you will play a key role in strengthening our research-to-fabrication pipeline.
By training junior team members and sharing best practices, you will help build a culture of knowledge transfer and operational excellence.
Ultimately, your work will have a direct impact on advancing semiconductor technology, as you push the boundaries of what is possible in device manufacturing and integration.
Key Duties and Responsibilities Work with the supervisor and other team members to deliver the outputs of the project Hands on end-to-end fabrication of device runs in the Tyndall flexifab Setup and execution of DOEs for process and device optimization Implement in-line and end-of-line process metrology to monitor process performance Investigate data from experimental runs to provide data-driven recommendations for process improvements and modifications Closely collaborate with researchers and domain experts to translate ideas into practical fabrication flows Perform risk assessments of new flows or equipment integration Documentation of process flows, recipes and experimental results Reporting of results in internal meetings Staying current with processing methods for TMD materials reported in the literature and applying them where applicable Process engineering support for tools specific to project (e.g.
laser spike anneal) Train junior engineers, interns or researchers on tool operation, safety protocols and fabrication procedures Participate in Education and Public Engagement activities, as required.
Ensure all activities are compliant with the Tyndall Quality Management system.
Ensure all activities are compliant with the required Health and Safety standards.
Carry out any additional duties as may reasonably be required within the general scope and level of the post Essential Criteria MSc degree in physics, material science, chemistry or related discipline Minimum 3 years on hands-on experience with end-to-end wafer fabrication processes in a cleanroom environment Demonstrated competence in at least 3 semiconductor processing techniques e.g.
photolithography, deposition, etch Knowledge of in-line and end-of-line metrology techniques (e.g.
SEM, AFM, ellipsometry) Experience in building process fabrication flows from ideation/concept stage Experience with DOE setup for process/device optimization Familiarity with risk assessments and compliance with safety and quality protocol Desirable Criteria Self-motivated and shows initiative and strong desire to learn new field Strong ability to scritinise experimental data and make data-driven decisions Ability to work effectively in cross-functional teams and translate research ideas into practical fabrication solutions Proven track record of documenting process flows, recipes and experimental results clearly and accurately Ability to report results and present findings in internal meetings Strong understanding of cleanroom standards, chemical handling, hazardous material protocols and commitment to ensuring safety and quality protocols are followed The duration of the contract is a for a fixed term of approximately 24 months with the possibility to extend by 18 months upon the availability of funding, satisfactory performance, mutual agreement and a detailed career development plan.
What we Offer We offer progressive employment and training policies including opportunities for further studies.
At Tyndall we value Ambition, Collaboration, Diversity, Excellence and Integrity.
You will be supported throughout to grow your skillset and learn how to adapt in new challenges to develop your career.
As an equal opportunity employer we offer a comprehensive suite of flexible working and family friendly initiatives.
A list of such initiatives is available on our webpage.
Tyndall has an Athena Swan Bronze award, reflecting our commitment to ensuring equity of opportunity for all researchers regardless of gender or ethnicity.
We are actively improving our internal processes to build on the Athena Swan award and have a vibrant People and Culture team driving initiatives.
Tyndall has an active EDI (Equality, Diversity and Inclusion) group which delivers initiatives to enhance EDI within the Institute.
At Tyndall, your work will shape the future contributing to technology innovation for Ireland’s economy and the society at large.
As a key national institute, Tyndall’s world-class research teams perform ground-breaking research with an ‘excellent impact from excellent research’ philosophy.
Appointment may be made on the UCC Technical Officer Salary Scale € 48,438 – €66,286 p.a.. Salary placement on appointment will be in accordance with the public sector pay policy.
Informal enquiries concerning this position can be made to Niamh Waldron Closing date for application is 1pm 16th May 2025 Application Instructions Please make sure to attach an up to date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.
A full candidate information pack is available by clicking here.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
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