Job Details: Fab Sort Manufacturing (FSM) is responsible for producing all Intel silicon using advanced manufacturing processes across multiple global sites, including Arizona, Ireland, Israel, Oregon, and a new greenfield site in Ohio.
Intel has established the HVM Global Yield organization within FSM to enhance yield operations and facilitate rapid yield ramp-up during early HVM phases, collaborating with the Technology Development (TD) team and FSM fabs.
This position seeks a Failure Analysis and Fault Isolation (FA/FI) Engineer for our Ireland Analytical Laboratories, which operate 24/7.
The successful candidate will support technology development and yield improvement through electrical and physical failure analyses (EFA / PFA).
The team supports both product and test chips, covering data analysis, workflow planning, sample preparation, nanoprobing, fault isolation, report generation, and customer presentations.
Engineers may focus on specific modules or the entire analysis flow.
Responsibilities: Review support requests to determine initial failure analysis and fault isolation workflows to identify root causes.
Operate laboratory equipment such as curve tracers, photon emission microscopes, laser stimulation systems (OBIRCH), and infrared imaging systems.
Conduct failure analysis workflows using Ga and plasma FIBs, nanoprobing, and sample preparation tools.
Collaborate with TEM experts to interpret failure causes.
Support the development of new workflows and techniques for continual improvement.
Understand upstream and downstream techniques in the lab to ensure high-quality results with efficient throughput.
Present analysis results to internal and external customers.
Behavioral Skills: Strong teamwork, analytical problem-solving, and communication skills.
Inquisitiveness and a desire to learn and expand knowledge.
Ability to work effectively with multi-disciplinary and multicultural teams.
Decision-making and problem-solving capabilities.
Qualifications: Minimum Qualifications: Bachelor's degree in science or engineering with 4+ years of lab experience.
For Ireland candidates: minimum Level 8 Bachelor's degree.
Master's degree in science or engineering with 3+ years of lab experience.
Ph.D.
in science or engineering with 1+ years of lab experience.
Experience working on silicon die or wafer-level fault isolation/failure analysis.
Preferred Qualifications: Advanced degree (Master's or Ph.D.) in science or engineering.
Over 4 years of experience in a semiconductor failure analysis lab supporting advanced nodes.
Experience with 6T SRAM and logic failure analysis.
Proficiency with fault isolation and failure analysis tools.
Understanding of FinFET architecture.
Knowledge of wafer fabrication and microelectronics.
Experience with electrical and physical failure analysis flows.
Hands-on laboratory equipment operation skills.
Willingness to work Front End or Back End Day Shifts.
Additional Details: Qualifications can be obtained through relevant industry experience, internships, schoolwork, or research.
Job Type: Experienced Hire
Shift: Shift 1 G (Ireland)
Location: Ireland, Leixlip
Business Group: Intel's Technology Development and Manufacturing Group, focused on semiconductor process development, manufacturing, yield improvement, and more.
Work Model: Hybrid work model allowing a mix of on-site and off-site work, subject to change.
To apply, visit our careers page and complete the application process.
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