Job Details
Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and a new greenfield site in Ohio.
Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team, and FSM fabs.
This job requisition is seeking a Failure Analysis and Fault Isolation (FA/FI) Engineer working in our FSM Ireland Analytical Laboratories which operates 24/7.
Responsibilities:
* Review incoming support requests and determine initial failure analysis / fault isolation workflow to identify and visualize root cause.
* Hands on operation of laboratory equipment, such as curve tracing, photon emission microscopy, laser stimulation (OBIRCH), and infrared imaging systems.
* Conduct failure analysis workflows using Ga and plasma FIBs, nanoprobing and sample preparation equipment.
* Mentor and coordinate workflows with supporting with Transmission Electron Imaging (TEM) experts to interpret and explain failure root cause.
* Support continual improvement and development of new workstreams and techniques.
* Develop a thorough understanding of upstream and downstream techniques in the lab and work seamlessly with peers of different disciplines to get high quality results with fast throughput time.
* Present results of key analyses to internal and external customers.
Requirements:
* Bachelor's degree in science and engineering major with 4+ years' related lab experience or Ireland candidates minimum Level 8 Bachelors' degree or Masters degree in science and engineering major and 3+ years' related lab experience or Ph.D. in science and engineering major with 1+ years' related lab experience.
* Experience working on silicon die or wafer level fault isolation / failure analysis.
* Advanced degree (Master's or Ph.D.) in science and engineering major preferred.
* 4+ years' experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development.
* 4+ years' experience with 6T SRAM and logic failure analysis.
* Experience operating fault isolation and failure analysis tools.
* Understanding of FinFET technology architecture.
* Knowledge of wafer fabrication and general microelectronics.
* Knowledge of electrical and physical failure analysis flows for semiconductor.
* Hands on experience operating laboratory equipment.
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.