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PhD Position on Chiplet-Enabled Silicon Photonics: Advancing Packaging and Integration for Scalable, High-Performance Systems, Cork
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Client:
Tyndall National Institute
Location:
Cork, Ireland
Job Category:
Other
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EU work permit required:
Yes
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Job Reference:
27af705f39a6
Job Views:
1
Posted:
02.05.2025
Expiry Date:
16.06.2025
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Job Description:
PhD Position on Chiplet-Enabled Silicon Photonics: Advancing Packaging and Integration for Scalable, High-Performance Systems Contract : Full Time/Fixed Term Project Overview Silicon photonics is poised to revolutionize high-speed interconnects, sensing, and computing, but traditional monolithic integration struggles with yield, cost, and scalability as system complexity grows.
The chiplet paradigm—breaking down large chips into smaller, specialized dies integrated in a single package - has gained traction in electronics and offers a compelling solution for photonics.
This Ph.D.
project aims to develop a photonic-electronic chiplet platform to allow for modularity and scalable packaging for diverse applications.
By applying chiplet concepts to silicon photonics, we can: Enhance modularity for mixing photonic and electronic functions.
Improve yield by fabricating smaller, optimized dies separately.
Enable scalable, cost-effective packaging for diverse applications.
Expected Outcomes: A chiplet-based optical interconnect framework complementing traditional fibre-to-device integration.
A validated photonic-electronic systems-in-package prototype demonstrating low loss inter-chiplet coupling.
A thermo-mechanical framework to demonstrating high reliability risk areas.
A scalable chiplet assembly processes toward commercialization.
About the Studentship The PhD candidate will be offered a 4-year scholarship, based in the Tyndall National Institute (TNI)/University College Cork (UCC) laboratories.
The PhD student will be part of a dynamic photonics packaging research team comprising PhD students, post-doctoral researchers, and research professionals.
The successful PhD candidate will work on design, simulation, fabrication and characterisation of a photonic-electronic chiplet platform.The PhD project will involve close collaboration with leading researchers in the field and access to state-of-the-art facilities for packaging and reliability testing, providing an excellent environment for scientific discovery and innovation.
The successful candidate will receive training in all research methods required for the project, including packaging processes, simulation suites and reliability facilities.
The PhD student will have the opportunity to present their research at national and international conferences and publish in high-impact journals.
Key Responsibilities Design and validate a chiplet-based packaging architecture for co-integrating photonic chiplets with electronic chiplets.
Investigate thermo-mechanical behaviour of chiplet-based photonic systems-in-package.
Investigate reliability performances of chiplet-based photonic systems-in-package.
Collaborate with internal and external researchers.
Successfully complete the minimum required taught modules in technical subjects and transferable and generic skills.
Disseminate research findings through peer-reviewed publications and conference presentations.
Regularly participate in public engagement and outreach activities.
Ensure all activities are compliant with the Tyndall Quality Management system.
Ensure all activities are compliant with the required Health and Safety standards.
Carry out any additional duties as may be reasonably required within the general scope and level of the post.
Essential Criteria A Master’s degree in Physics, Engineering, or Materials Science or in a relevant field.
A First-Class Honors Degree (2:1 or higher) in Physics, Engineering, Materials Science, Chemistry, or a related discipline.
Demonstrated ability to work independently and as part of a team.
The candidate must be highly self-motivated, be able to demonstrate initiative and have a desire to learn.
The candidate must possess good scientific writing and communication skills.
Desirable Criteria Prior experience with semiconductor packaging in industrial settings.
Knowledge of electromagnetics, optics, fluids or thermo-mechanical modelling.
Hands on experience with reliability and characterisation tools.
The position is offering an annual stipend of €25,000.
The position is available for an immediate start, once academic approval has been received from University College Cork.
Closing date of applications is 2nd May 2025 For informal queries, please contact Peter O’Brien.
Application Instructions Please make sure to attach an up-to-date CV/Resume AND a brief cover letter outlining how you meet the criteria for this role.
Postgraduate applicants whose first language is not English must provide evidence of English language proficiency as per UCC regulations ( https://www.ucc.ie/en/study/comparison/english/postgraduate/ ).
Certificates should be valid (usually less than 2 years old) and should be uploaded with their application.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process.
Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
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