Senior Packaging EngineerIreland - DublinKey ResponsibilitiesLead the development of advanced packaging technologies, including Flip-Chip, Fan-Out, 2.5D/3D, and System-in-Package (SiP) solutions.Collaborate closely with design, process, materials, and reliability engineering teams to ensure high-performance, manufacturable packages.Drive package technology development from concept through mass production—covering material selection, process integration, and qualification.Perform feasibility studies, risk assessments, and provide recommendations for continuous improvement.Develop and optimize thermal, mechanical, and electrical models for package performance and reliability.Work with suppliers, foundries, and OSATs to ensure manufacturing scalability and seamless integration.Conduct failure analysis and drive corrective actions to improve yield and reliability.Stay ahead of industry trends and actively contribute to packaging innovation.Mentor and provide technical leadership to junior engineers within the team.Required QualificationsBachelor’s, Master’s, or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.5+ years of hands-on experience in semiconductor packaging, including advanced packaging technologies.Strong knowledge of package design, material science, and process integration.Experience with simulation tools for thermal, mechanical, and electrical modeling.Proven success working with OSATs and foundries in packaging development and qualification.Excellent problem-solving, communication, and cross-functional collaboration skills.Preferred QualificationsExperience with heterogeneous integration, chiplet packaging, or advanced interconnects.Familiarity with PCB and substrate design.Knowledge of industry standards such as IPC, JEDEC, and SEMI.Proficiency in EDA tools like Cadence Allegro, Mentor Graphics, or Synopsys.
#J-18808-Ljbffr