Cork: Competitive
Would you like to work for a cutting edge technology company specialising in the development of display technology for wearable devices? A Principal Packaging Engineer is now required to join the expanding team. The Principal Packaging Engineer will play a key role in the development of the next generation MicroLED products, including leading the microLED device packaging development.
Key Responsibilities:
The successful candidate will be responsible for leading the MicroLED packaging and micro-assembly development including:
1. Development of state-of-art MicroLED assembly techniques.
2. Identification of and engagement with external assembly partners.
3. Work closely with other cross-functional members to define the micro-assembly solution based on the complimentary requirements from an LED, automation and product perspectives.
The ideal candidate will be degree qualified or equivalent and have an extensive track record within a similar environment with a particular emphasis on micro-packaging and device manipulation at a micro-scale. This job is particularly suited to an experienced engineer who wishes to further develop their career in a vibrant and fast-moving company. Experience in some or all of the following would be a distinct advantage: Micro-assembly and micro-packaging, III-V and GaN compound semiconductors, Automation and high precision position systems, including control and vision alignment, Surface chemistry, bonding and behaviour of devices at µm dimensions and managing partners and subcontractors from a technical and project management perspective.
Key words: semiconductor, assembly, Engineer, Lead, Cork, Ireland, MicroLED, III-V, GaN, micro-assembly, micro-packaging, bonding, µm, Europe