About Analog Devices
Analog Devices is a place where innovation meets impact. For over 55 years, we have been inventing new breakthrough technologies that transform lives.
We foster a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.
The Team
The Analog Devices International (ADI) Limerick Failure Analysis Team is part of the Global Quality Group responsible for providing analysis services and systems to support new product/technology development from the ADI Ireland site.
Our team defines the failure analysis flow, seeking detection of the failure mechanism which leads to solving the root cause of our customer's issue. We are part of the Failure Analysis Centre of Excellence and support and lead failure analysis and characterisation for several leading-edge development projects within ADI.
Job Role
A vacancy is currently open within the Quality Group for a Failure Analysis Engineer to support new product development, Fab Yield & Process transfer, and FA tools/techniques.
The job will entail working closely with internal teams to support development process cycles of Integrated Circuits, using a wide variety of materials characterisation & failure analysis techniques.
Responsibilities
* To support/lead IC (Integrated circuit) failure analysis for ADI's portfolio of products for release.
* To support emerging materials technology development for ADI's (More Than Moore) portfolio of products.
* To liaise with design, product, reliability, and FAB engineers in order to efficiently and accurately analyse new development products and provide analysis/characterisation support.
* To develop new methodologies for the analysis and inspection of novel devices and materials.
* To operate and develop SPM- Scanning Probe Microscopy techniques - AFM, SCM, MFM.
* To liaise with other FA materials engineers around the globe to support key projects.
* Routine use of electrical bench test setups, fault localisation systems, (Thermal, LEM, OBIRCH) sample preparation and inspection tools (X-ray, FIB, SEM, EDX, TEM, XPS, optical, mechanical polishing, broad ion beam polishing, wet chemical etching, plasma etching etc).
* To compile reports for large interdisciplinary audiences (Quality & Design engineers, Sales & Marketing, FAB process engineers etc.).
* To consult with internal customers in relation to a broad range of appropriate failure analysis & materials characterisation techniques (e.g. LEM, OBIRCH, SEM, FIB, TEM, XPS, AFM, etc.).
* To assist in maintenance of lab-based tools (Fault localisation systems, sample preparation & inspection tools) to ensure system uptime and efficiency. Leasing with vendors and support teams.
* To mentor and consult with other engineers in relation to IC & materials analysis and characterisation.
* To drive Continuous Improvement, Lean manufacturing & problem-solving activities.
* To showcase new FA analysis/characterisation developments at both internal level (ADI conferences and project meetings) in addition to external level (international conferences etc.).
Qualifications
To be successful in this role, you will require:
* BSC/BEng in Electronic Engineering, Physics, or related discipline with relevant industry experience an advantage.
* Having a CO-OP or internship placement in a manufacturing company preferred but not essential.
* Strong problem-solving skills with an aptitude for hands-on work; Semiconductor/ materials analysis and characterisation experience would be a distinct advantage.
* Broad knowledge of semiconductor/materials characterisation techniques including characterisation systems, features and functionality.
* Excellent organisation and communication skills (including interdisciplinary communication skills).
* Full training will be provided as required on hiring.