PhD Project: Micro-Optics and Packaging for Co-Packaged Optics on Electro-Optic Glass Interposers
Contract: Full Time/Fixed Term
Project Overview
This PhD project will develop advanced optical and electrical packaging solutions to enable next-generation Co-Packaged Optics (CPO) systems. CPO is rapidly emerging as the preferred architecture for data centre and AI accelerator interconnects, where optical and electronic functions are tightly integrated to achieve higher bandwidth, lower latency, and dramatically improved energy efficiency compared to traditional pluggable optics. The project will focus on designing and optimising micro-optical components to couple light into and out of electro-optic glass interposers with minimal insertion loss, targeting coupling efficiencies better than 1 dB and optical path lengths below one millimetre. The student will use simulation tools such as Lumerical, Zemax, or COMSOL to design compact lens, grating, or mirror structures, evaluate their tolerance to misalignment, and optimise them for manufacturability at wafer scale.
In parallel, the project will address the packaging challenges associated with co-integrating photonic and electronic chiplets on advanced glass interposers. These interposers enable a combination of dense optical I/O, low-loss RF transmission lines, and precise mechanical registration, which together are essential for scaling CPO systems. Research tasks will include exploring waveguide pitch reduction in the 10–15 µm range to increase optical channel density, developing precision alignment and bonding strategies, and investigating underfill and encapsulation methods that maintain optical performance while providing mechanical stability and thermal management. Consideration will also be given to electrical performance, with the goal of supporting broadband RF interconnects up to 70 GHz without compromising optical alignment or signal integrity. The work will culminate in the assembly of demonstrator modules that combine multiple optical channels with high-speed electronic interfaces, fabricated and characterised using the advanced packaging and measurement facilities available at Tyndall.
Depending on their background and interests, the candidate will have opportunities to focus on optical design and simulation, process development, system-level modelling, or hands-on experimental work. Access to Tyndall’s state-of-the-art cleanroom and packaging laboratories will be available for those who wish to engage in microfabrication or assembly activities, but participation in experimental work can be tailored to suit the student’s skills and project direction. The candidate will gain experience in working across disciplines and with industry-aligned research projects, building a skill set that is highly relevant to careers in photonic integration, advanced packaging, and high-speed interconnect development. The outcomes of this project will contribute to scalable, energy-efficient optical interconnects for future data centres and AI computing platforms, addressing one of the most pressing challenges in modern computing infrastructure.
The successful candidate will receive training in all research methods required for the project, including packaging processes, simulation suites and reliability facilities. The PhD student will have the opportunity to present their research at national and international conferences and publish in high-impact journals.
Key Responsibilities
* Explore waveguide pitch reduction in the 10–15 µm range to increase optical channel density.
* Develop precision alignment and bonding strategies.
* Investigate underfill and encapsulation methods that maintain optical performance while providing mechanical stability and thermal management.
* Collaborate with internal and external researchers.
* Successfully complete the minimum required taught modules in technical subjects and transferable and generic skills.
* Disseminate research findings through peer-reviewed publications and conference presentations.
* Regularly participate in public engagement and outreach activities.
* Ensure all activities are compliant with the Tyndall Quality Management system.
* Ensure all activities are compliant with the required Health and Safety standards.
* Carry out any additional duties as may be reasonably required within the general scope and level of the post.
Essential Criteria
* A First-Class Honors Degree (2:1 or higher) in Physics, Engineering, Materials Science, Chemistry, or a related discipline.
* Demonstrated ability to work independently and as part of a team.
* The candidate must be highly self-motivated, be able to demonstrate initiative and have a desire to learn.
* The candidate must possess good scientific writing and communication skills.
Desirable Criteria
* Prior experience with semiconductor packaging in industrial or research settings.
* Hands on experience with reliability and characterisation tools.
What We Offer
A fully funded PhD position that includes a stipend of €25,000/year for up to four years and full coverage of academic fees. The successful candidate will be registered as PhD student at University College Cork.
Doctoral students are going to be equipped with the highest level of scientific and engineering research skills needed to address the challenges of developing new integrated photonic technologies for diverse applications, as well as with the entrepreneurial, leadership and teamwork capabilities needed to lead and operate at the highest levels in industry.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
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