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FEOL (Front-End-Of-Line) Staff Process Integration Development Engineer
Company: Intel
Job Description
Intel's Fab Sort Manufacturing (FSM) is responsible for producing advanced semiconductor silicon across multiple facilities worldwide. The FSM is expanding to meet increasing demand, integrating cutting-edge technologies into high-volume manufacturing.
This role involves working within the HVM Global Yield organization, collaborating with various teams to optimize processes and improve yield during early production stages. Responsibilities include leading engineering projects, implementing new technologies, analyzing yield issues, managing NPI processes, and partnering with yield teams to enhance product quality and reduce costs.
Qualifications
* Minimum: Bachelor's degree in a relevant science or engineering field with at least 8 years of experience.
* Experience in advanced node semiconductor industry, especially in FEOL Process Integration.
* Proficiency in device physics, with experience in FinFET or Gate-All-Around technology.
* Knowledge of module processes like lithography, etching, CMP, diffusion, implantation, and metrology.
* Strong problem-solving and communication skills, with the ability to work effectively in diverse teams.
Preferred Qualifications
* Master's or Ph.D. in Electrical Engineering, Physics, or Materials Science.
* Experience in project management, external customer engagement, and GAA technology.
Additional Information
This position is based in Ireland, Leixlip, and follows a hybrid work model. The role supports Intel’s mission to advance semiconductor manufacturing and is open to qualified applicants regardless of race, gender, or other protected characteristics.
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