Posted: 1 January
Offer description
Design RF Front-End Architectures for High Frequency SoC
We are seeking a highly motivated and experienced individual to contribute to our team's success in the design, simulation, and validation of fully integrated RF front-end architectures for high frequency System-on-Chip (SoC).
The successful candidate will have expertise in advanced packaging environments, including Si, ceramic, and organic substrates, as well as experience with EM and circuit-level models, system-in-package (SiP) performance optimization, and RF characterization and validation.
* Design and simulation of RF/mm-wave circuits and interconnect structures within advanced packaging environments.
* Develop EM and circuit-level models for 3D interposers and evaluate signal integrity, coupling, and parasitics.
* Collaborate with circuit, packaging, and materials teams to optimize system-in-package (SiP) performance.
* Conduct RF characterization and validation of packaged components and prototypes.
You will be part of a team conducting research in areas such as Analog Precision Circuits, RF and High-Speed Transceivers, Cryogenic CMOS, and Integrated Power Systems.
