PositionIntel Ireland Device Engineering team (Yield department) is looking for Device Engineering talents to join our advanced technology Fab. This role reports to the manager of the Device team and focuses on advanced FinFETs technology device engineering/development, working closely with Integration, Module, and yield teams to achieve yield ramp‑up, process optimization, and support internal and external customers.ResponsibilitiesDrive factory product Power and Performance roadmap as a member/leader of the Performance TMI team to ensure products meet customer specifications.Own engineering projects to execute HVM yield roadmap, device targeting, and attain performance targets.Work with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.Participate or lead cross‑organizational teams to identify root cause of device‑related yield/performance issues and define mitigation plans.Own NPI (New Product Introduction) in production fab and perform device‑related process optimizations to meet foundry customer specifications.Develop models to predict device performance accurately in early‑to‑mid stage of Si progression and drive systematic solutions to maintain baseline performance.Collaborate with Process Integration engineers to drive process simplification and implement cost‑reduction opportunities.Qualifications – BehavioralProblem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solutions.Teamwork & Partnership: Strong teamwork skills and ability to build effective partnerships.Communication: Excellent written and verbal communication skills, with the ability to influence at all levels.Self‑Motivation: Motivated self‑starter able to work independently and collaboratively.Flexibility: Maturity and adaptability in facing uncertainties and changing priorities.Goal Commitment: Commitment to achieving aggressive goals with a strong sense of urgency.Qualifications – MinimumRelevant Bachelor’s, Master’s, or Ph.D. degree in Device Physics, Electronics, Physics, Chemistry or related technical field.5–10 years of experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration.5–10 years of experience in FinFET technology development or high‑volume manufacturing.5–10 years of experience with Device Physics and hands‑on application in a real‑world fab environment.Qualifications – PreferredAdvanced degree (Master’s or Ph.D.) in Electrical Engineering, Physics or Materials Science.Experience driving product performance roadmaps working with Process, Integration, and Yield teams.Experience working on process transfers to High Volume Manufacturing factories, solving complex integrated issues.Demonstrated interpersonal skills including influencing, engaging, and motivating.Experience serving external Foundry customers through technical interactions.Experience in GAA (Gate‑All‑Around) technology architecture.Experience in new semiconductor technology development.Basic understanding and collaboration experience with module processes: lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.Job DetailsJob Type: Experienced HireShift: Shift 1 (Ireland)Primary Location: Leixlip, IrelandCompensation: €71,300.00 – €111,300.00 (annual salary range; additional total compensation components may apply)All qualified applicants will receive consideration for employment regardless of race, color, religion, sex, national origin, age, disability, or any other characteristic protected by law.
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